Yingtao Ding,: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

Don't use scam websites

1

[IEEE 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) - Berlin, Germany (2019.6.23-2019.6.27)] 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) - A Piezoelectric MEMS Loud Speaker Based on Ceramic PZT

Wang, Haoran, Li, Mengyuan, Yu, Yuanyuan, Chen, Zhenfang, Ding, Yingtao, Jiang, Huabei, Xie, Huikai

Year:

2019

Language:

english

File:

PDF, 458 KB

english, 2019

2

Elimination of Scallop-Induced Stress Fluctuation on Through-Silicon-Vias (TSVs) by Employing Polyimide Liner

Xue, Chengbo, Cheng, Zhiqiang, Chen, Zhiming, Yan, Yangyang, Cai, Ziru, Ding, Yingtao

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2018

Language:

english

File:

PDF, 2.65 MB

english, 2018

3

MEMS Ultrasound Transducers for Endoscopic Photoacoustic Imaging Applications

Wang, Haoran, Ma, Yifei, Yang, Hao, Jiang, Huabei, Ding, Yingtao, Xie, Huikai

Journal:

Year:

2020

File:

PDF, 14.65 MB

2020

4

A 25–35 GHz 5-bit digital attenuator with low RMS amplitude error and low phase variation in 65 nm CMOS

Li, An’an, Ding, Yingtao, Chen, Zhiming, Chi, Baoyong

Journal:

IEICE Electronics Express

Year:

2019

Language:

english

File:

PDF, 1.70 MB

english, 2019

5

Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner

Ding, Yingtao, Yan, Yangyang, Chen, Qianwen, Wang, Shiwei, Su, Rui, Dang, Hua

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 2.03 MB

english, 2014

6

Design and implementation of a low-pass filter for microsensor signal processing

Wang, Zhuping, Zhong, Shun'an, Ding, Yingtao, Wang, Xiaoqing

Journal:

Journal of Semiconductors

Year:

2010

Language:

english

File:

PDF, 204 KB

english, 2010

7

Neutro-Connectedness Cut

Xian, Min, Zhang, Yingtao, Cheng, Heng-Da, Xu, Fei, Ding, Jianrui

Journal:

IEEE Transactions on Image Processing

Year:

2016

Language:

english

File:

PDF, 3.17 MB

english, 2016

8

Electrical Characterization of Coaxial Silicon–Insulator–Silicon Through-Silicon Vias: Theoretical Analysis and Experiments

Chen, Zhiming, Xiong, Miao, Li, Bohao, Li, An'an, Yan, Yangyang, Ding, Yingtao

Journal:

IEEE Transactions on Electron Devices

Year:

2016

Language:

english

File:

PDF, 1.80 MB

english, 2016

9

Investigation of dynamic thermal behaviors of an electrothermal micromirror

Zhou, Lingfeng, Chen, Zhiming, Cheng, Jin, Chen, Qiao, Ding, Yingtao, Xie, Huikai

Journal:

Sensors and Actuators A: Physical

Year:

2017

Language:

english

File:

PDF, 701 KB

english, 2017

10

[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - Low cost polyimide liner formation with vacuum-assisted spin coating for through-silicon-vias

Yan, Yangyang, Zhang, Ziyue, Cheng, Zhiqiang, Zhou, Lingfeng, Chen, Zhiming, Ding, Yingtao

Year:

2016

Language:

english

File:

PDF, 2.28 MB

english, 2016

11

Automatic Breast Ultrasound Image Segmentation: A Survey

Xian, Min, Zhang, Yingtao, Cheng, H.D., Xu, Fei, Zhang, Boyu, Ding, Jianrui

Journal:

Pattern Recognition

Year:

2018

Language:

english

File:

PDF, 1.02 MB

english, 2018

12

Modelling and Experimental Verification of Step Response Overshoot Removal in Electrothermally-Actuated MEMS Mirrors

Li, Mengyuan, Chen, Qiao, Liu, Yabing, Ding, Yingtao, Xie, Huikai

Journal:

Year:

2017

Language:

english

File:

PDF, 4.56 MB

english, 2017

13

Comparative evaluations on scallop-induced electric-thermo-mechanical reliability of through-silicon-vias

Cheng, Zhiqiang, Ding, Yingtao, Xiao, Lei, Wang, Xinghua, Chen, Zhiming

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 2.85 MB

english, 2019

14

[IEEE 2019 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2019.10.8-2019.10.10)] 2019 International 3D Systems Integration Conference (3DIC) - Design and Evaluation of a Novel and Ultra-Compact Fully-TGV-based Self-Shielding Bandpass Filter for 5G Applications

Zhang, Ziyue, Ding, Yingtao, Chen, Zhiming, Zhou, Mingrui, Xiao, Lei, Cai, Ziru, Xiong, Miao, Gong, Xiao

Year:

2019

File:

PDF, 713 KB

2019

15

An improved quantitative measurement for thyroid cancer detection based on elastography

Jianrui Ding, H.D. Cheng, Jianhua Huang, Yingtao Zhang, Jiafeng Liu

Journal:

European Journal of Radiology

Year:

2012

Language:

english

File:

PDF, 871 KB

english, 2012

16

Breast Ultrasound Image Classification Based on Multiple-Instance Learning

Jianrui Ding, H. D. Cheng, Jianhua Huang, Jiafeng Liu, Yingtao Zhang

Journal:

Journal of Digital Imaging

Year:

2012

Language:

english

File:

PDF, 333 KB

english, 2012

17

Low-Background, Highly Sensitive DNA Biosensor by Using an Electrically Neutral Cobalt(II) Complex as the Redox Hybridization Indicator

Wang, Qingxiang, Ding, Yingtao, Wang, Liheng, Ni, Jiancong, Yu, Zhanglong, Lin, Haibin, Gao, Feng

Journal:

Chemistry – An Asian Journal

Year:

2013

Language:

english

File:

PDF, 1.02 MB

english, 2013

18

Highly sensitive and selective DNA biosensor using a dumbbell-shaped bis-groove binder of bi-acetylferrocene ethylenediamine complex as electrochemical indicator

Ding, Yingtao, Wang, Qingxiang, Gao, Feng, Gao, Fei

Journal:

Electrochimica Acta

Year:

2013

Language:

english

File:

PDF, 1.88 MB

english, 2013

19

Highly selective DNA biosensor based on the long-range electron transfer of indigo carmine through DNA duplex

Qingxiang Wang, Yingtao Ding, Liheng Wang, Cai Gao, Feng Gao, Fei Gao

Journal:

Microchimica Acta

Year:

2012

Language:

english

File:

PDF, 545 KB

english, 2012

20

A sensitive DNA biosensor based on a facile sulfamide coupling reaction for capture probe immobilization

Wang, Qingxiang, Ding, Yingtao, Gao, Feng, Jiang, Shulian, Zhang, Bin, Ni, Jiancong, Gao, Fei

Journal:

Analytica Chimica Acta

Year:

2013

Language:

english

File:

PDF, 1.52 MB

english, 2013

21

DNA biosensor based on a glassy carbon electrode modified with electropolymerized Eriochrome Black T

Wang, Liheng, Liao, Xiaolei, Ding, Yingtao, Gao, Fei, Wang, Qingxiang

Journal:

Microchimica Acta

Year:

2014

Language:

english

File:

PDF, 518 KB

english, 2014

22

[IEEE 2011 4th International Congress on Image and Signal Processing (CISP) - Shanghai, China (2011.10.15-2011.10.17)] 2011 4th International Congress on Image and Signal Processing - A novel quantitative measurement for thyroid cancer detection based on elastography

Ding, Jianrui, Cheng, H.D., Huang, Jianhua, Zhang, Yingtao, Ning, Chunping

Year:

2011

Language:

english

File:

PDF, 258 KB

english, 2011

23

Thermal reliability analysis and optimization of polymer insulating through-silicon-vias (TSVs) for 3D integration

Zhong, ShunAn, Wang, ShiWei, Chen, QianWen, Ding, YingTao

Journal:

Science China Technological Sciences

Year:

2014

Language:

english

File:

PDF, 812 KB

english, 2014

24

Investigation on mechanism of polymer filling in high-aspect-ratio trenches for through-silicon-via (TSV) application

YingTao Ding,YangYang Yan,QianWen Chen…

Journal:

Science China Technological Sciences

Year:

2014

Language:

english

File:

PDF, 3.68 MB

english, 2014

25

A high-performance, low-area reconfiguration controller for network-on-chip-based partial dynamically reconfigurable system-on-chip designs

Wang, Ling, Ding, Chunda, Wen, Dongxin, Jiang, Yingtao

Journal:

International Journal of Electronics

Year:

2010

Language:

english

File:

PDF, 1.01 MB

english, 2010

26

[IEEE 2010 Ninth IEEE Sensors Conference (SENSORS 2010) - Kona, HI (2010.11.1-2010.11.4)] 2010 IEEE Sensors - A monolithic inertial measurement unit fabricated with improved DRIE post-CMOS process

Hongzhi Sun,, Kemiao Jia,, Yingtao Ding,, Zhongyang Guo,, Xuesong Liu,, Guizhen Yan,, Huikai Xie,

Year:

2010

Language:

english

File:

PDF, 2.08 MB

english, 2010

27

Cell trapping and patterning using dielectric-structure-assisted negative dieletrophoresis

Hua Dang,YingTao Ding,ZheYao Wang

Journal:

Science China Technological Sciences

Year:

2013

Language:

english

File:

PDF, 897 KB

english, 2013

28

[IEEE 2008 Chinese Control and Decision Conference (CCDC) - Yantai, Shandong, China (2008.07.2-2008.07.4)] 2008 Chinese Control and Decision Conference - License plate character recognition algorithm based on filled function method training bp neural network

Ying Zhang,, Yingtao Xu,, Gejian Ding,

Year:

2008

Language:

english

File:

PDF, 175 KB

english, 2008

29

[IEEE 2014 International Conference on Power System Technology (POWERCON) - Chengdu (2014.10.20-2014.10.22)] 2014 International Conference on Power System Technology - A wide-area coordinated out-of-step control system

Wang Yingtao,, Tang Yong,, Ding Lijie,, Zhang Chuankai,, Chen Zhen,, Huang Yuanchao,

Year:

2014

Language:

english

File:

PDF, 547 KB

english, 2014

30

Electrical characteristics of a novel interposer technique using ultra-low-resistivity silicon-pillars with polymer insulation as TSVs

Wang, Weijiang, Yan, Yangyang, Ding, Yingtao, Wang, Shiwei, Wang, Weimin, Sun, Yipeng, Chen, Qianwen

Journal:

Microelectronic Engineering

Year:

2015

Language:

english

File:

PDF, 1.07 MB

english, 2015

31

An Efficient Algorithm for Direction Finding against Unknown Mutual Coupling

Wang, Weijiang, Ren, Shiwei, Ding, Yingtao, Wang, Haoyu

Journal:

Year:

2014

Language:

english

File:

PDF, 409 KB

english, 2014

32

[IEEE 2014 7th International Conference on Biomedical Engineering and Informatics (BMEI) - Dalian, China (2014.10.14-2014.10.16)] 2014 7th International Conference on Biomedical Engineering and Informatics - Multiple-instance learning with global and local features for thyroid ultrasound image classification

Ding, Jianrui, Cheng, H. D., Huang, Jianhua, Zhang, Yingtao, Cheng, H. D.

Year:

2014

Language:

english

File:

PDF, 280 KB

english, 2014

33

Innovative polyimide liner deposition method for high-aspect-ratio and high-density through-silicon-vias (TSVs)

Ding, Yingtao, Xiong, Miao, Yan, Yangyang, Wang, Shiwei, Chen, Qianwen, Wang, Weijing, Chen, Zhiming

Journal:

Microelectronic Engineering

Year:

2016

Language:

english

File:

PDF, 1.12 MB

english, 2016

34

[IEEE 2015 IEEE International Conference on Image Processing (ICIP) - Quebec City, QC, Canada (2015.9.27-2015.9.30)] 2015 IEEE International Conference on Image Processing (ICIP) - A saliency model for automated tumor detection in breast ultrasound images

Shao, Haoyang, Zhang, Yingtao, Xian, Min, Cheng, H. D., Xu, Fei, Ding, Jianrui

Year:

2015

Language:

english

File:

PDF, 1.39 MB

english, 2015

35

Highly conformal polyimide liner deposition in high-aspect-ratio through-silicon-vias (TSVs)

Ding, Yingtao, Chen, Zhiming, Chen, Qianwen, Wang, Shiwei, Yan, Yangyang, Xiong, Miao

Journal:

Micro & Nano Letters

Year:

2016

Language:

english

File:

PDF, 903 KB

english, 2016

36

Study of Vacuum-Assisted Spin Coating of Polymer Liner for High-Aspect-Ratio Through-Silicon-Via Applications

Yan, Yangyang, Ding, Yingtao, Fukushima, Takafumi, Lee, Kang-Wook, Koyanagi, Mitsumasa

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 4.56 MB

english, 2016

37

Design of DDS based on Hybird-CORDIC Architecture

Qu, Xiujie, Chen, He, Zhang, Yubin, Ding, Yingtao

Journal:

International Journal of Computational Intelligence Systems

Year:

2011

Language:

english

File:

PDF, 592 KB

english, 2011

38

Wideband Capacitance Evaluation of Silicon–Insulator–Silicon Through-Silicon-Vias for 3D Integration Applications

Wang, Xinghua, Xiong, Miao, Chen, Zhiming, Li, Bohao, Yan, Yangyang, Ding, Yingtao

Journal:

IEEE Electron Device Letters

Year:

2016

Language:

english

File:

PDF, 868 KB

english, 2016

39

[IEEE 2015 IEEE International Conference on Image Processing (ICIP) - Quebec City, QC, Canada (2015.9.27-2015.9.30)] 2015 IEEE International Conference on Image Processing (ICIP) - An algorithm based on LBPV and MIL for left atrial thrombi detection using transesophageal echocardiography

Ding, Jianrui, Xian, Min, Cheng, H. D., Zhang, Yingtao, Xu, Fei

Year:

2015

Language:

english

File:

PDF, 700 KB

english, 2015

40

Modeling and analysis of vertical noise coupling in TSV-based 3D mixed-signal integration

Wang, Shiwei, Ding, Yingtao, Chen, Zhiming, He, Huanyu, Lu, Jian-Qiang

Journal:

Microelectronic Engineering

Year:

2016

Language:

english

File:

PDF, 3.11 MB

english, 2016

41

Temperature-aware multi-application mapping on network-on-chip based many-core systems

Cao, Shan, Salcic, Zoran, Li, Zhaolin, Wei, Shaojun, Ding, Yingtao

Journal:

Microprocessors and Microsystems

Year:

2016

Language:

english

File:

PDF, 2.67 MB

english, 2016

42

[IEEE 2016 IEEE Winter Conference on Applications of Computer Vision (WACV) - Lake Placid, NY, USA (2016.3.7-2016.3.10)] 2016 IEEE Winter Conference on Applications of Computer Vision (WACV) - Unsupervised saliency estimation based on robust hypotheses

Xu, Fei, Xian, Min, Cheng, H. D., Ding, Jianrui, Zhang, Yingtao

Year:

2016

Language:

english

File:

PDF, 634 KB

english, 2016

43

SPIE Proceedings [SPIE Seventh International Symposium on Multispectral Image Processing and Pattern Recognition (MIPPR2011) - Guilin, China (Friday 4 November 2011)] MIPPR 2011: Parallel Processing of Images and Optimization and Medical Imaging Processing - Ultrasonic classification of breast tumors based on multi-instance learning

Huang, Jianhua, Liu, Jianguo, Ding, Mingyue, Hu, Cong, Zhang, Yingtao, Chen, Zhong, Liu, Jiafeng, Tang, Xianglong

Year:

2011

Language:

english

File:

PDF, 531 KB

english, 2011

44

[IEEE 2015 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2015.8.31-2015.9.2)] 2015 International 3D Systems Integration Conference (3DIC) - Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio TSVs applications

Yan, Yangyang, Ding, Yingtao, Chen, Qianwen, Lee, Kangwook, Fukushima, Takafumi, Koyanagi, Mitsu

Year:

2015

Language:

english

File:

PDF, 1.04 MB

english, 2015

45

Low capacitance and highly reliable blind through-silicon-vias (TSVs) with vacuum-assisted spin coating of polyimide dielectric liners

Yan, YangYang, Xiong, Miao, Liu, Bin, Ding, YingTao, Chen, ZhiMing

Journal:

Science China Technological Sciences

Year:

2016

Language:

english

File:

PDF, 1.69 MB

english, 2016

46

[IEEE 2015 IEEE 11th International Conference on ASIC (ASICON ) - Chengdu, China (2015.11.3-2015.11.6)] 2015 IEEE 11th International Conference on ASIC (ASICON) - Design of a dynamically reconfigurable arithmetic unit for matrix algorithms

Wang, Weijiang, Ding, Yingtao, Cao, Shan, Zhao, Xianli

Year:

2015

Language:

english

File:

PDF, 251 KB

english, 2015

47

[IEEE 2016 International Conference on Optical MEMS and Nanophotonics (OMN) - Singapore, Singapore (2016.7.31-2016.8.4)] 2016 International Conference on Optical MEMS and Nanophotonics (OMN) - A large-piston scanning electrothermal micromirror with a temperature control frame

Jiawen Luo,, Zhiming Chen,, Yingtao Ding,, Qiao Chen,, Jinling Ding,, Jin Cheng,, Xie, Huikai

Year:

2016

Language:

english

File:

PDF, 588 KB

english, 2016

48

Data-classification-based SNR estimation for linearly modulated signals

Moazzeni, Taleb, Jiang, Yingtao, Chen, Tian-Ding

Journal:

Computers & Electrical Engineering

Year:

2016

Language:

english

File:

PDF, 1.63 MB

english, 2016

49

A Behavior-based Adaptive Access-mode for Low-power Set-associative Caches in Embedded Systems

Ye, Jiongyao, Ding, Hongfeng, Hu, Yingtao, Watanabe, Takahiro

Journal:

Journal of Information Processing

Year:

2012

Language:

english

File:

PDF, 1.60 MB

english, 2012

50

Analysis before Starting an Access: A New Power-Efficient Instruction Fetch Mechanism

YE, Jiongyao, HU, Yingtao, DING, Hongfeng, WATANABE, Takahiro

Journal:

IEICE Transactions on Information and Systems

Year:

2011

Language:

english

File:

PDF, 952 KB

english, 2011